GSTMPDrill350A High-precision laser micro-hole processing (laser drilling and cutting) equipment

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Presentation of the equipment's characteristics

The equipment is mainly developed for raw porcelain micro-hole processing. It adopts a high-precision galvanometer system, has the ability to process through holes with a diameter of 50μm, and has a processing efficiency of more than 3500 holes/minute. It has a high-precision image recognition and positioning function, which can realize automatic alignment processing.

processed samples
  • The minimum diameter of the hole that can be processed is 50μm, and the processing efficiency is as high as more than 3,500 holes per minute;
  • Supports dxf file import and configures CAM software to meet the processing functions of multiple tool combinations;
  • With PSO function, lead processing function, and path optimization function;
ParameterValue
Maximum Processing Size (mm)210×210
Minimum Hole Diameter (μm)Φ50
Diameter Accuracy (μm)≤±4
Drilling Efficiency (holes/min)≥3500(Φ50μ[email protected])
Hole Taper (μm)≥85% (Φ50μ[email protected])
Hole Roundness (μm)≤4
Position Accuracy (μm)≤±10
Positioning Accuracy (μm)±3
Repeat Positioning Accuracy (μm)±2
Automatic Loading/UnloadingEquipped with AGV trolley logistics transportation

Laser cutting solution Overview: Compared with traditional industrial cutting methods, laser cutting effectively reflects the processing advantages of photon manufacturing such as high precision and flexibility. It is widely used for precision cutting in the electronics field, such as consumer electronics, automotive electronics, communication electronics, etc.

Results ImageDescription
Connector Material Bridge Cutting: The single-side material bridge cutting time (0.2mm thick copper nickel/tin-plated) is 0.12s. High efficiency meets standard production line CT requirements, with no carbonization and no burrs. OS yield rate is greater than 99%. SI testing shows no defects.
In-Vehicle Camera Low-Temperature Welding: The weld seam width is 0.7mm, penetration depth is 0.4mm, and the efficiency reaches 10mm/s. The welding temperature is below 60℃, with a clean appearance, no oxidation blackening, and no spatter.
DPC Circuit Board Cutting: The cutting efficiency for a 0.5mm thick board is 20mm/s, while for a 1mm thick board, it is 5mm/s. Dimensional accuracy reaches ±20μm, and the scribing half-cut efficiency is 200mm/s.
PCB QR Code Marking: The QR code is of Grade A with an engraving size accuracy of ±0.05mm. The laser spot is uniform and round, and the background pattern is clear.
PCB Carbon-Free Cutting: The cutting speed for a 2mm thick PCB board is 25mm/s, with an accuracy of ±20μm. The heat-affected zone is less than 20μm, and the edges remain carbon-free.
MinLED Backplane Carbon-Free Cutting: The cutting speed for a 1.6mm thick board is 25mm/s, with an accuracy of ±20μm. The heat-affected zone is less than 20μm, and the edges remain carbon-free.