High-Purity Spherical Copper Powder for Metal 3D Printing, LPBF, DED and Advanced Manufacturing
Product Overview
GREENSTONE High-Purity Spherical Copper Powder is a high-performance metal powder engineered for metal additive manufacturing and advanced industrial applications requiring excellent electrical conductivity, thermal conductivity, high purity, and controlled powder flowability.
With a copper purity of Cu ≥99.9%, the powder features a highly spherical morphology, controlled particle size distribution, low oxygen content, and stable flow characteristics. It is suitable for Laser Powder Bed Fusion (LPBF), Directed Energy Deposition (DED), Binder Jetting, and other compatible powder-based manufacturing processes.
GREENSTONE spherical copper powder is designed for the production of high-performance conductive and thermal-management components used in electronics, electrical engineering, heat exchangers, automotive systems, aerospace, energy, industrial manufacturing, and research applications.
Different particle size distributions can be supplied according to the additive manufacturing process, equipment configuration, and final component requirements.
High-Purity Copper – Cu ≥99.9%
High copper purity minimizes the influence of impurities on electrical and thermal performance, making the powder suitable for applications where high conductivity and reliable material properties are required.
Highly Spherical Powder Morphology
Controlled spherical morphology provides excellent powder flowability and packing behavior. This contributes to uniform powder deposition, stable processing, and improved consistency during metal additive manufacturing.
Excellent Electrical & Thermal Conductivity
Pure copper combines outstanding electrical conductivity with high thermal conductivity, making it particularly suitable for manufacturing components such as:
- Electrical conductors and busbars
- Heat exchangers and heat sinks
- Induction components
- Thermal management structures
- Conductive industrial components
- Customized heat-transfer parts
Optimized for Metal Additive Manufacturing
GREENSTONE spherical copper powder can be supplied for multiple metal additive manufacturing technologies, including:
LPBF – Laser Powder Bed Fusion
DED – Directed Energy Deposition
Binder Jetting
Particle size distribution can be selected according to the requirements of different equipment and deposition processes.
Controlled Particle Size Distribution
Standard particle size ranges include:
15–45 μm
45–75 μm
Customized particle size distributions are also available according to process and equipment requirements.
Controlled particle size contributes to consistent powder spreading, stable feeding performance and repeatable manufacturing quality.
Low Oxygen Content
The powder is controlled to a low oxygen level of <300 ppm, helping reduce oxidation-related effects and supporting stable melting or sintering behavior.
This is particularly important for copper because surface oxidation can affect processing stability and final material performance.
Excellent Flowability
With a typical Hall flow rate of <25 s/50 g, the spherical powder provides good feeding and spreading characteristics for compatible powder-based manufacturing systems.
High Apparent Density
A typical apparent density of 4.5–5.2 g/cm³ contributes to efficient powder packing and stable material deposition.
Wide Industrial Applications
Electronics & Electrical Engineering: Busbars, conductive components, electrical contacts, induction components and customized electrical structures.
Thermal Management: Heat exchangers, heat sinks, cooling structures and high-efficiency thermal-management components.
Aerospace & Automotive: Lightweight thermal-management structures, cooling components and specialized conductive parts.
Energy & Industrial Manufacturing: Heat-transfer components, electrical systems, specialized industrial components and customized metal parts.
Research & Development: Material development, additive manufacturing process research, prototype manufacturing and advanced conductive-material applications.
Flexible Powder Supply
GREENSTONE can provide different particle size distributions and powder specifications according to the customer’s manufacturing technology, equipment platform and application requirements, supporting both R&D and industrial production.
| Parameter | Specification |
|---|---|
| Product Name | High-Purity Spherical Copper Powder |
| Brand | GREENSTONE |
| Material | Pure Copper |
| Chemical Symbol | Cu |
| Copper Purity | ≥99.9% |
| Powder Morphology | Spherical |
| Typical Particle Size | 15–45 μm / 45–75 μm |
| Customized Particle Size | Available |
| Theoretical Density | Approx. 8.96 g/cm³ |
| Melting Point | Approx. 1083°C |
| Apparent Density | 4.5–5.2 g/cm³ |
| Hall Flow Rate | <25 s/50 g |
| Oxygen Content | <300 ppm |
| Additive Manufacturing Processes | LPBF / DED / Binder Jetting |
| Key Material Properties | High Electrical Conductivity, High Thermal Conductivity, High Purity |
| Powder Characteristics | High Sphericity, Good Flowability, Controlled Particle Size Distribution |
| Typical Industries | Electronics, Electrical Engineering, Thermal Management, Aerospace, Automotive, Energy, Industrial Manufacturing |
| Typical Applications | Busbars, Heat Exchangers, Heat Sinks, Cooling Components, Conductive Components, Customized Metal Parts |
| Supply Options | Standard and Customized Particle Size Distributions |
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