Prezentace charakteristik zařízení
The equipment is mainly developed for connector bridge cutting, taking into account multiple factors such as laser processing efficiency, processing accuracy and processing format. It can achieve efficient and high-quality laser cutting processing of bridges within the range of 70x70mm, photon flexible manufacturing, and bring a new processing method for connector processing. It provides high-reliability manufacturing and can accurately cut composite materials (plastic-metal combined products) without damaging the plastic.
zpracované vzorky
- The laser cutting seam is narrow, which is convenient for cutting small-sized material bridges;
- It can save the time and cost of mold opening;
- Save the time of mechanical adjustment and alignment;
- No burrs on the processed edge;
- Flexible processing methods and good product compatibility;
- PI verification is fast and convenient.
| Parametr | Specifikace |
| Laser | 30W Fiber Laser |
| Workpiece Size (mm) | 70X70 (Dual Head) |
| Processable Material | Connector Material Bridge (Copper Nickel-plated, Copper Tin-plated) |
| Processable Material Thickness (mm) | 0.2 |
| Cutting Accuracy | ±15μm @0.2mm Thick Material Bridge |
| CCD Positioning Accuracy (μm) | ±10 |
| Working Environment Temperature (°C) | 10~40 |
| Compressed Air Pressure (Mpa) | 0.5~0.8 |
| Napájení (V) | Single-phase AC 220V |
| Equipment Size (mm) (W×D×H) | 1600X1200X1880 |
| Equipment Weight (kg) | 1500 |
Laser cutting solution Overview: Compared with traditional industrial cutting methods, laser cutting effectively reflects the processing advantages of photon manufacturing such as high precision and flexibility. It is widely used for precision cutting in the electronics field, such as consumer electronics, automotive electronics, communication electronics, etc.
| Obrázek výsledků | Popis |
 | Connector Material Bridge Cutting: The single-side material bridge cutting time (0.2mm thick copper nickel/tin-plated) is 0.12s. High efficiency meets standard production line CT requirements, with no carbonization and no burrs. OS yield rate is greater than 99%. SI testing shows no defects. |
 | In-Vehicle Camera Low-Temperature Welding: The weld seam width is 0.7mm, penetration depth is 0.4mm, and the efficiency reaches 10mm/s. The welding temperature is below 60℃, with a clean appearance, no oxidation blackening, and no spatter. |
 | DPC Circuit Board Cutting: The cutting efficiency for a 0.5mm thick board is 20mm/s, while for a 1mm thick board, it is 5mm/s. Dimensional accuracy reaches ±20μm, and the scribing half-cut efficiency is 200mm/s. |
 | PCB QR Code Marking: The QR code is of Grade A with an engraving size accuracy of ±0.05mm. The laser spot is uniform and round, and the background pattern is clear. |
 | PCB Carbon-Free Cutting: The cutting speed for a 2mm thick PCB board is 25mm/s, with an accuracy of ±20μm. The heat-affected zone is less than 20μm, and the edges remain carbon-free. |
 | MinLED Backplane Carbon-Free Cutting: The cutting speed for a 1.6mm thick board is 25mm/s, with an accuracy of ±20μm. The heat-affected zone is less than 20μm, and the edges remain carbon-free. |
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