Scientific research type high vacuum magnetron sputtering coating machine GST-CS series is our company’s scientific research and pilot type high vacuum magnetron sputtering instrument, which mainly uses circular magnetron sputtering target for sputtering to prepare metals, alloys, compounds, semiconductors, ceramics, dielectric composite films and other chemical reaction films, etc.; suitable for coating various single-layer films, multi-layer films, doped films and alloy films; can be used for coating magnetic materials and non-magnetic materials.
It can be used for the research and development of TGV/TSV/TMV advanced packaging, and deep hole seed layer coating with high aspect ratio (≥10:1).
Key technical features of the equipment
Adhering to the concept that equipment provides a means of realization for process realization, we have made the following design and engineering realization, which has a good actual operation effect and provides a precise process equipment solution for the user’s special process realization.
Combined treatment of the back of the target and the surface of the sputtering target
– It is difficult to achieve direct surface contact between the target and the target surface. If surface contact cannot be achieved, the contact resistance will increase, resulting in insufficient amplitude of the ionization electric field (increased contact resistance, increased electric field partial pressure on the contact surface), resulting in poor coating effect; increased resistance causes the target to heat up and reduce the coating quality.
– Poor contact between the target and the target surface leads to poor water cooling effect and reduced coating quality.
– Add a layer of soft and thin material with special electrical and thermal conductivity to ensure surface contact.
Adjustable distance
The distance between the substrate and the target can be adjusted to meet the distance requirements of the film forming process of different target materials.
Adjustable angle
The magnetron sputtering target head can adjust the angle so as to make precise control for the uniformity of substrates of different sizes.
Integrated cabinet structure
Advantages of integrated cabinet structure:
Good safety (operators will not touch high-voltage components and rotating components)
Small footprint, size is about: 1100mm long × 780mm wide (standard office door is 800mm wide) (traditional equipment is about 2200mm × 1000mm), two devices can be placed in the same area of ​​workspace.
Control system
Adopt computer + PLC two-level control system
Safety
– Detection and protection of power system
– Set vacuum detection and alarm protection function
– Temperature detection and alarm protection
– Pressure detection and flow of cooling circulating water system
– Detection and alarm protection
Gas uniformity technology
The process gas adopts gas uniformity technology, the gas field is more uniform, and the coating is more uniform.
Substrate heating technology
Adopt armored heating wire. Since the metal wire heated by electricity is not exposed in the vacuum chamber, no impurities are released during high-temperature heating, ensuring the purity of the film. The armored heating wire is placed in the temperature equalizer to ensure the uniform temperature, and then the substrate is heated.
Higher vacuum degree and faster pumping speed
The inside and outside of the vacuum chamber are all electrochemically polished to completely remove the microscopic burrs on the surface (visible under a microscope), leaving no microscopic dirt and grime hiding places. The surface area of ​​the chamber is reduced by more than half, the coating is purer, the vacuum degree is higher, and the pumping speed is faster.
Equipment structure and performance:
1. Single coating chamber, double coating chamber, single coating chamber + sample chamber, coating chamber + glove box
2. Number and type of magnetron sputtering targets: 1 to 6 targets, circular plane targets
3. Target installation position: from bottom to top, from top to bottom, oblique, sideways
4. Magnetron sputtering targets: RF, IF, DC pulse, DC compatible
5. The substrate can be rotated, heated, raised and lowered, and biased
6. Reactive sputtering coating can be performed by introducing reactive gas
7. Operation mode: manual, semi-automatic, fully automatic
8. If a higher background vacuum is required, LOADLOCK needs to be configured, ultra-high vacuum magnetron sputtering targets and sample transfer adopts folding type, ultra-high vacuum manipulator or vacuum manipulator, and the system limit vacuum can reach 10-8Pa
Main technical indicators of the equipment
– Substrate bracket: configured according to the size of the supply.
– Substrate heater temperature: configured according to the user’s supply requirements. The temperature can be controlled by computer programming and is controllable and adjustable.
– Automatic substrate speed: 2~20 rpm.
– The substrate rack can be heated, rotated, and raised and lowered.
– The distance from the target surface to the substrate is adjustable from 30mm to 140mm.
– 1 to 6 Φ2~Φ12 inch flat circular targets, equipped with pneumatic target control panels, the target can swing to adjust the angle.
– The ultimate vacuum of the coating chamber: 6X10-5Pa~7X10-8Pa, restore the working background vacuum to 7×10-4Pa: about 30 minutes (new equipment is filled with dry nitrogen)
– The overall leakage rate of the equipment: the vacuum degree is ≤5Pa after shutting down for 12 hours