High vacuum electron beam evaporation coating machine (PVD coating equipment) is a method of heating and evaporating materials by electron beam bombardment under high vacuum conditions to coat various metals, oxides, conductive films, optical films, semiconductor films, ferroelectric films, superhard films, etc. on substrates; it can coat single-layer films, multi-layer films or doped films of mixtures; it can coat various high melting point materials.

It can be used for production, scientific experiments and teaching, and can be customized according to user requirements.

According to user requirements, two modes of automatic control of quartz crystal film thickness and automatic control of optical film thickness can be selected. Through the combination of PLC and industrial computer, the whole coating process can be automatically controlled, including the vacuum system, baking system, evaporation process and film thickness monitoring functions, thereby improving work efficiency and ensuring the consistency and stability of product quality.

Equipment features

The equipment has the characteristics of high vacuum, fast pumping speed, and convenient substrate loading and unloading. It is equipped with E-type electron beam evaporation source and resistance evaporation source. PID automatic temperature control has the advantages of uniform film formation, small degassing volume and uniform temperature.
According to the user’s requirements, two modes of automatic control of quartz crystal film thickness and automatic control of optical film thickness can be selected. Through the combination of PLC and industrial computer, the whole coating process can be automatically controlled, including the vacuum system, baking system, evaporation process and film thickness monitoring functions, so as to improve work efficiency and ensure the consistency and stability of product quality.
Vacuum performance
Ultimate vacuum: 7×10-5Pa～7×10-6Pa
Overall leakage rate of equipment: shutdown for 12 hours, ≤10Pa
Short time to restore working vacuum, atmosphere to 7×10-4Pa≤30 minutes;

High vacuum electron beam evaporation coating machine (electron beam evaporation coating machine) equipment composition
E-type electron beam evaporation gun, resistance thermal evaporation source assembly (optional), sample mask baffle system, vacuum acquisition system and vacuum measurement system, molecular pump vacuum unit or cryogenic pump vacuum unit, rotating substrate heating table, working gas path, sample transfer mechanism, film thickness control system, electronic control system, constant temperature cooling water system, etc.
Optional: film thickness monitor, constant temperature cooling water tank.
Optional: coating machine + glove box

Resistive thermal evaporation source type
– Tantalum (tungsten or molybdenum) metal boat thermal evaporation source component
– Quartz boat thermal evaporation source component
– Tungsten electrode or tungsten blue thermal evaporation source component
– Tantalum furnace thermal evaporation source component (with boron nitride crucible or ceramic crucible)
– Beam source furnace thermal evaporation component (with quartz crucible or boron nitride crucible)
Operation mode: manual, semi-automatic