GSTSDrill 100H/200L high-speed micro-hole processing (laser drilling) equipment

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Presentation of the equipment's characteristics

The equipment uses high-power QCW quasi-continuous fiber laser as the light source, equipped with a six-axis and five-axis linkage motion control system, and realizes circular hole, blade-shaped hole, and complex surface trajectory cutting through adaptive positioning technology and real-time precise control technology of laser parameters. This equipment is mainly used for efficient cutting and hole-making applications of sheet metal and forging parts in two-engine power and aerospace power, such as blade-shaped hole cutting of compressor stators and guide vanes, and film hole punching and trimming applications of flame tubes with or without coatings.

processed samples
  • A variety of machine tool structures are available to meet the needs of different workpiece sizes;
  • Six-axis and five-axis linkage, three-dimensional laser drilling;
  • Laser impact drilling and nesting drilling;
  • Optical double-swing axis laser processing head, with good processing accessibility;
  • Can realize laser processing focus correction of complex morphology workpieces;
  • Thin-wall rotary parts follow-up adaptive positioning function;
  • Coaxial vision system based on machine vision, with processing process monitoring and auxiliary positioning functions;
  • Workpiece model feature extraction, rapid processing and production of NC programs;
  • Rotary body flying punching function, greatly improving processing efficiency.
ParameterValue
X/Y/Z Axis Travel (mm)1000×750×1000 (optional)
B/C Axis Travel (°)±135/n×360
C1 Axis Travel (°)n×360
X/Y/Z Axis Positioning Accuracy (°)0.02
B/C Axis Positioning Accuracy (″)20
C1 Axis Positioning Accuracy (″)15
X/Y/Z Axis Repeatability (mm)0.01
B/C Axis Repeatability (″)10
C1 Axis Repeatability (″)6
Laser Power (w)1500 (optional)
Equipment Weight (t)10
Equipment Dimensions (mm) (W×D×H)6340×5540×3900 (optional)
Workpiece Size (mm)Φ1200×800 (Max Φ1400×800) (optional)

High-speed micro-hole processing solution overview: Aiming at the efficient manufacturing needs of dense groups of holes in large-sized complex parts in the fields of aerospace, automobile, etc., we focus on high-efficiency and high-quality laser processing technology, and provide customers with high-end fine processing services and a full set of product solutions including millisecond laser, nanosecond laser, long and short pulse composite laser.

Results picturesdescription
High-efficiency machining of special-shaped holes in high-temperature alloys. The maximum processing size is ≤Φ1000mm×600mm. The remelting layer thickness is controlled within ≤0.03mm, the hole diameter accuracy reaches ≤±0.02mm, and the cutting speed can reach ≥200mm/min.
Massive group hole machining of special-shaped holes in coated combustion chambers. The maximum processing size is ≤Φ1000mm×600mm. The hole-making accuracy reaches ±0.03mm, the recast layer thickness is controlled within ≤0.05mm, and the single-hole processing time is ≤15 seconds.
Mass hole machining of coated ceramic matrix composite combustion chambers with a machining accuracy of ±0.03mm. The ceramic fibers remain unbroken and non-oxidized, with no surface ablation.