Laser cutting solution Overview: Compared with traditional industrial cutting methods, laser cutting effectively reflects the processing advantages of photon manufacturing such as high precision and flexibility. It is widely used for precision cutting in the electronics field, such as consumer electronics, automotive electronics, communication electronics, etc.

Results Image	Description
	Connector Material Bridge Cutting: The single-side material bridge cutting time (0.2mm thick copper nickel/tin-plated) is 0.12s. High efficiency meets standard production line CT requirements, with no carbonization and no burrs. OS yield rate is greater than 99%. SI testing shows no defects.
	In-Vehicle Camera Low-Temperature Welding: The weld seam width is 0.7mm, penetration depth is 0.4mm, and the efficiency reaches 10mm/s. The welding temperature is below 60℃, with a clean appearance, no oxidation blackening, and no spatter.
	DPC Circuit Board Cutting: The cutting efficiency for a 0.5mm thick board is 20mm/s, while for a 1mm thick board, it is 5mm/s. Dimensional accuracy reaches ±20μm, and the scribing half-cut efficiency is 200mm/s.
	PCB QR Code Marking: The QR code is of Grade A with an engraving size accuracy of ±0.05mm. The laser spot is uniform and round, and the background pattern is clear.
	PCB Carbon-Free Cutting: The cutting speed for a 2mm thick PCB board is 25mm/s, with an accuracy of ±20μm. The heat-affected zone is less than 20μm, and the edges remain carbon-free.
	MinLED Backplane Carbon-Free Cutting: The cutting speed for a 1.6mm thick board is 25mm/s, with an accuracy of ±20μm. The heat-affected zone is less than 20μm, and the edges remain carbon-free.