GSTLD8000 Multi-axis femtosecond laser micro-hole forming equipment (high-precision laser drilling equipment)

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Presentation of the equipment's characteristics

This laser drilling equipment is a special equipment for high-precision micro-hole forming. It is equipped with high-quality industrial femtosecond lasers, with excellent beam quality and small power fluctuation. With high-precision multi-axis control system, it can realize controllable taper fine processing of micro-circular holes, square holes, special-shaped holes, micro-cavities, cavities and other structures on various materials such as various metals, non-metals, high-temperature alloys, composite materials, etc. It is mainly used for high-precision micro-hole forming processing of key parts in industries such as air film holes of aircraft engine turbine blades and automobile fuel injectors.

processed samples

The laser drilling equipment is equipped with a high-quality industrial femtosecond laser with excellent beam quality and small power fluctuation. With the high-precision multi-axis control system, it can realize the controllable taper fine processing of micro-circular holes, square holes, special-shaped holes, micro-cavities, cavities and other structures on various metals, non-metals, high-temperature alloys, composite materials and other materials. It is used in aerospace, biomedicine, semiconductors, consumer electronics and other fields, and is suitable for high-precision micro-hole forming processing of key parts in the industry such as air film holes of aircraft engine turbine blades, automobile fuel injectors, and medical filter micro-holes.

Equipment features
● High-precision multi-axis control system with high-precision multi-axis beam scanning module supports three-dimensional special-shaped micro-hole forming processing on complex surfaces;
● High-precision laser rangefinder with self-developed algorithm to realize the whole process of laser focal length;
● High-degree-of-freedom, high-speed beam scanning system, which can flexibly control the processing trajectory to realize positive taper, no taper, and reverse taper micro-hole forming processing;
● High-precision laser power control system, which can control the amount of material removed by a single pulse, can realize high-precision fixed-depth straight and blind hole processing.

Equipment advantages
●Femtosecond cooling laser: Femtosecond cooling removal, no heat effect, good flexibility in processing a variety of materials, no rotation of materials.
●Laser cutting without stress: The material sublimates when exposed to light, without contact, directly breaking the molecular bonds of the material to instantly ionize the material in the action area, removing the material at a microscopic scale, and eliminating the trouble of stress damage.
●Precise control of thermal effects: According to different thermal effect requirements, select a suitable light source and match the appropriate laser processing parameters to minimize thermal effects;
●Clean processing: Real-time laser smoke treatment is carried out during laser processing, and harmful substances, odors or fine dust are filtered through dust removal and filtration to meet the requirements of exhausting into the atmosphere.

Technical ParametersSpecification
Laser1030nm / 515nm / 343nm
Power Stability<0.5% RMS @ 24 hours
Processing Area350mm × 350mm (Customizable)
Repeat Positioning AccuracyX: <±2 μm; Y: <±2 μm; Z: <±3 μm; A: ≤8″; C: ≤8″
Minimum Machinable Hole Diameter<15μm
Depth-to-Diameter Ratio20:1
Roundness97%
Power Supply SpecificationThree-phase 380V ±10%; 50Hz
Equipment Power15 kW
Ambient Temperature22±3℃
Relative Humidity55% ±10%
Technical Parameters

Working Principle

Laser drilling refers to the laser processing process in which the laser is focused as a high-intensity heat source to heat the material, causing the material in the laser action area to melt or vaporize and then evaporate, thereby forming a hole. The laser beam is highly concentrated in space and time. By focusing with a lens, the spot diameter can be reduced to a laser power density of 10 to the 5th power ~ 10 to the 15th power W/cm2. Such a high power density can be used to laser drill holes in almost any material. For example, micron-sized holes can be processed on high-melting-point molybdenum plates, small holes of tens of microns can be processed on cemented carbide (tungsten carbide), deep holes of hundreds of microns can be processed on ruby ​​and sapphire merchants, diamond wire drawing dies, chemical fiber spinnerets, etc.

Air film cooling generally requires a large number of air film holes with different diameters ranging from 100um to 700um to be drilled on turbine blades. Most of them are inclined holes, and they are diversified and irregularly distributed. Therefore, these air film holes often cannot be directly molded and cast in one go, and require reprocessing in the subsequent process. Traditional high-speed electrospark drilling inevitably produces recast layers and microcracks, which cause blade fatigue and affect flight safety, while electro-hydraulic beam drilling, electrolytic drilling and other methods have low processing efficiency and slightly poor economic benefits.

Using ultra-short pulse laser drilling technology is one of the laser processing technologies for industrial applications. Advanced laser drilling technology plays an important role in modern manufacturing industries such as aerospace and heavy ships.

ItemSpecification
Machine Travel (X/Y/Z Axis) (mm)300 / 300 / 25
(A/C Axis) (°)±50 / ±360
Repeat Positioning Accuracy (X/Y Axis) (mm)±0.0015
(A/C Axis) (″)8
C-Axis Load Capacity (kg)≤5
Maximum Machining Hole Accuracy (mm)±0.001
Maximum Depth-to-Diameter Ratio12:1
Hole Diameter Range (mm)0.03 ~ 2.3
Processing Efficiency1 s @ 0.15 mm Hole Depth
Hole Angle (°)-5 ~ +5
Processing Thickness (mm)3
Maximum Scanning Speed (H)600
Equipment Dimensions (mm)2300 (W) × 2200 (D) × 2000 (H)
Equipment parameters