Presentation of the equipment's characteristics

The equipment uses high-power pulsed laser as the processing light source. Through functions such as model reconstruction, mechanical axis + galvanometer axis five-axis linkage, it can achieve precision etching of large-scale rotating body surfaces, three-dimensional micro-curved surfaces and two-dimensional plane surfaces. The equipment has great advantages in high-efficiency and high-precision etching of three-dimensional surfaces.

processed samples
  • Gantry + rotary table machine tool structure, meet the surface etching of large-size rotating parts, compatible with 3D micro-curved surface and plane etching requirements;
  • With the 3D five-axis linkage function of mechanical axis + galvanometer axis, it ensures continuous etching without splicing, high precision and high efficiency;
  • Real-time reconstruction of 3D part models is realized, without model preprocessing simulation, suitable for a variety of parts processing;
  • With 3D model surface interpolation and path optimization functions, it can quickly perform processing preprocessing on the processing model;
  • With dedicated etching software, 3D rotating model image positioning and plane image measurement, hardware/process status monitoring and permission configuration functions.
ParameterValue
Machine travel (X/Y/Z axis) (mm)800/700/350
B-axis (°)n×360
Positioning accuracy (X/Y/Z axis) (mm)0.005/0.005/0.01
B-axis (arc sec)15
Rapid traverse speed (X/Y/Z axis) (mm/s)300/300/100
B-axis rotation speed (rpm)10
Laser average power (w)20
Maximum part weight (kg)20
Maximum table load (kg)30
Machine weight (kg)5000
Equipment footprint (mm) (W×D×H)3700X4350X3000

Laser Etching Processing Solution Overview: Aiming at the complex curved surface high-precision metal and non-metal microstructure processing needs of aerospace, we focus on the laser high-quality and high-efficiency processing technology of complex curved surface microstructures, and provide customers with high-end precision processing services and a full set of product solutions including nanosecond laser, picosecond laser and femtosecond laser.

Results picturesdescription
Metal Material Surface Laser Texturing
Laser processing on high-temperature alloy surfaces, with a maximum roughness of Ra15. Thin-walled parts experience no deformation, oxidation, or remelting layer.
Composite Material Surface Laser Texturing
Laser processing on fiber-type composite material surfaces. It exposes the glass fiber layer without damaging the glass substrate, and the substrate does not blacken or carbonize.
Resonant Microstructure Etching (1)
Suitable for multi-layer metal coatings + composite substrates. The etching depth is ≤30μm, processing accuracy is ±0.01mm, and the minimum processing size is 0.1mm. The coating does not peel off after etching, and the substrate does not blacken or carbonize.
Resonant Microstructure Etching (2)
Suitable for 70μm copper coatings + glass fiber composites. The etching depth is ≤30μm, processing accuracy is ±0.01mm, and the minimum processing size is 0.1mm. The copper coating has no residue, and substrate damage is minimal.
Resonant Microstructure Etching (3)
Suitable for 3μm aluminum coatings + glass fiber composites. The etching depth is ≤5μm, processing accuracy is ±0.01mm, and the minimum processing size is 0.1mm. No aluminum particles residues, and the glass fiber does not carbonize.
Resonant Microstructure Etching（4）
Processing accuracy ±0.01mm, minimum processing size 0.1mm. Suitable for metal coatings + composite material substrates. The process etches the metal coating on the surface without damaging, blackening, or carbonizing the composite material.
Friction Ring Etching
Etching depth 5±1μm, processing accuracy ±0.01mm, depth accuracy ±0.005mm. The part’s appearance has no scratches, oxidation, burrs, or remelting layer.
Hemispherical Metal Shield Cutting
Metal thickness: 0.3mm, tolerance: 0.1mm. Part size: φ300mm, height: 180mm, individual element size: 1.18mm. Processing accuracy: ±0.01mm, minimum processing size: 0.1mm. No burrs or oxidation after cutting.
Special Coating Microstructure Engraving Lines
Utilizes five-axis linkage (X, Y, Z, Gx, Gy) laser processing. Engraving line width ≤0.02mm, processing depth ≤0.01mm, and line spacing is 0.2±0.005mm. The engraved lines are uniform, with no significant bending or deformation, and appear blackened.