Presentation of the equipment's characteristics
The equipment uses a high-power ultrafast laser as the processing light source and is equipped with an AC cradle for parts clamping. It mainly performs precision etching processing on the surface of complex three-dimensional curved parts and components, and has five-axis five-linkage, curved model block splicing, parallel light projection and other functions for three-dimensional model processing, which can realize the surface etching function of non-expandable three-dimensional curved surfaces.
- It has the function of etching large-scale complex surfaces that cannot be expanded in three dimensions;
- It has the function of three-dimensional model analysis and programming, which can realize accurate block division and path optimization of large-scale surface graphics;
- It has the function of displaying the processing status of three-dimensional models, and visually displays the processing process;
- It has mature visual alignment measurement and high-precision automatic ranging and focusing functions;
- It has the function of hardware abnormal status monitoring, realizes human-computer interaction function, and is simple and easy to operate;
- One-click generation of processing data avoids manual programming, simple and easy to operate, and the entire processing process is fully automated;
- It has a safety interlocking function to prevent the safety door from opening during laser processing and harming personal safety;
- It has air blowing and smoke purification functions.
Parameter | Value |
Free Travel X/Y/Z (mm) | 800/500/450 |
Positioning Accuracy X/Y/Z (mm) | 0.015 |
Repeat Positioning Accuracy X/Y/Z (mm) | 0.010 |
Travel A/C (°) | ±110/0-360 |
Positioning Accuracy A/C (“) | 15 |
Repeat Positioning Accuracy A/C (“) | 10 |
Pulse Width (fs) | <290 |
Average Power (w) | 20 |
Maximum Workpiece Rotation Diameter (mm) | Φ200 |
Worktable Load Capacity (kg) | 20 |
Maximum Curved Surface Workpiece Size (mm) | Φ200×200 |
Maximum Flat Surface Workpiece Size (mm) | 700×400 (requires dedicated tooling) |
Scanning Surface Engraving Precision (mm) | ±0.02 |
Machine Weight (t) | Approx. 8 |
Equipment Footprint (mm) (W×D×H) | 4750×4200×2600 |
Laser Etching Processing Solution Overview: Aiming at the complex curved surface high-precision metal and non-metal microstructure processing needs of aerospace, we focus on the laser high-quality and high-efficiency processing technology of complex curved surface microstructures, and provide customers with high-end precision processing services and a full set of product solutions including nanosecond laser, picosecond laser and femtosecond laser.
Results pictures | description |
![]() | Metal Material Surface Laser Texturing Laser processing on high-temperature alloy surfaces, with a maximum roughness of Ra15. Thin-walled parts experience no deformation, oxidation, or remelting layer. |
![]() | Composite Material Surface Laser Texturing Laser processing on fiber-type composite material surfaces. It exposes the glass fiber layer without damaging the glass substrate, and the substrate does not blacken or carbonize. |
![]() | Resonant Microstructure Etching (1) Suitable for multi-layer metal coatings + composite substrates. The etching depth is ≤30μm, processing accuracy is ±0.01mm, and the minimum processing size is 0.1mm. The coating does not peel off after etching, and the substrate does not blacken or carbonize. |
![]() | Resonant Microstructure Etching (2) Suitable for 70μm copper coatings + glass fiber composites. The etching depth is ≤30μm, processing accuracy is ±0.01mm, and the minimum processing size is 0.1mm. The copper coating has no residue, and substrate damage is minimal. |
![]() | Resonant Microstructure Etching (3) Suitable for 3μm aluminum coatings + glass fiber composites. The etching depth is ≤5μm, processing accuracy is ±0.01mm, and the minimum processing size is 0.1mm. No aluminum particles residues, and the glass fiber does not carbonize. |
![]() | Resonant Microstructure Etching(4) Processing accuracy ±0.01mm, minimum processing size 0.1mm. Suitable for metal coatings + composite material substrates. The process etches the metal coating on the surface without damaging, blackening, or carbonizing the composite material. |
![]() | Friction Ring Etching Etching depth 5±1μm, processing accuracy ±0.01mm, depth accuracy ±0.005mm. The part’s appearance has no scratches, oxidation, burrs, or remelting layer. |
![]() | Hemispherical Metal Shield Cutting Metal thickness: 0.3mm, tolerance: 0.1mm. Part size: φ300mm, height: 180mm, individual element size: 1.18mm. Processing accuracy: ±0.01mm, minimum processing size: 0.1mm. No burrs or oxidation after cutting. |
![]() | Special Coating Microstructure Engraving Lines Utilizes five-axis linkage (X, Y, Z, Gx, Gy) laser processing. Engraving line width ≤0.02mm, processing depth ≤0.01mm, and line spacing is 0.2±0.005mm. The engraved lines are uniform, with no significant bending or deformation, and appear blackened. |
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