Presentation of the equipment's characteristics

The equipment uses a high-power ultrafast laser as the processing light source and is equipped with an AC cradle for parts clamping. It mainly performs precision etching processing on the surface of complex three-dimensional curved parts and components, and has five-axis five-linkage, curved model block splicing, parallel light projection and other functions for three-dimensional model processing, which can realize the surface etching function of non-expandable three-dimensional curved surfaces.

processed samples
  • It has the function of etching large-scale complex surfaces that cannot be expanded in three dimensions;
  • It has the function of three-dimensional model analysis and programming, which can realize accurate block division and path optimization of large-scale surface graphics;
  • It has the function of displaying the processing status of three-dimensional models, and visually displays the processing process;
  • It has mature visual alignment measurement and high-precision automatic ranging and focusing functions;
  • It has the function of hardware abnormal status monitoring, realizes human-computer interaction function, and is simple and easy to operate;
  • One-click generation of processing data avoids manual programming, simple and easy to operate, and the entire processing process is fully automated;
  • It has a safety interlocking function to prevent the safety door from opening during laser processing and harming personal safety;
  • It has air blowing and smoke purification functions.
ParameterValue
Free Travel X/Y/Z (mm)800/500/450
Positioning Accuracy X/Y/Z (mm)0.015
Repeat Positioning Accuracy X/Y/Z (mm)0.010
Travel A/C (°)±110/0-360
Positioning Accuracy A/C (“)15
Repeat Positioning Accuracy A/C (“)10
Pulse Width (fs)<290
Average Power (w)20
Maximum Workpiece Rotation Diameter (mm)Φ200
Worktable Load Capacity (kg)20
Maximum Curved Surface Workpiece Size (mm)Φ200×200
Maximum Flat Surface Workpiece Size (mm)700×400 (requires dedicated tooling)
Scanning Surface Engraving Precision (mm)±0.02
Machine Weight (t)Approx. 8
Equipment Footprint (mm) (W×D×H)4750×4200×2600

Laser Etching Processing Solution Overview: Aiming at the complex curved surface high-precision metal and non-metal microstructure processing needs of aerospace, we focus on the laser high-quality and high-efficiency processing technology of complex curved surface microstructures, and provide customers with high-end precision processing services and a full set of product solutions including nanosecond laser, picosecond laser and femtosecond laser.

Results picturesdescription
Metal Material Surface Laser Texturing
Laser processing on high-temperature alloy surfaces, with a maximum roughness of Ra15. Thin-walled parts experience no deformation, oxidation, or remelting layer.
Composite Material Surface Laser Texturing
Laser processing on fiber-type composite material surfaces. It exposes the glass fiber layer without damaging the glass substrate, and the substrate does not blacken or carbonize.
Resonant Microstructure Etching (1)
Suitable for multi-layer metal coatings + composite substrates. The etching depth is ≤30μm, processing accuracy is ±0.01mm, and the minimum processing size is 0.1mm. The coating does not peel off after etching, and the substrate does not blacken or carbonize.
Resonant Microstructure Etching (2)
Suitable for 70μm copper coatings + glass fiber composites. The etching depth is ≤30μm, processing accuracy is ±0.01mm, and the minimum processing size is 0.1mm. The copper coating has no residue, and substrate damage is minimal.
Resonant Microstructure Etching (3)
Suitable for 3μm aluminum coatings + glass fiber composites. The etching depth is ≤5μm, processing accuracy is ±0.01mm, and the minimum processing size is 0.1mm. No aluminum particles residues, and the glass fiber does not carbonize.
Resonant Microstructure Etching(4)
Processing accuracy ±0.01mm, minimum processing size 0.1mm. Suitable for metal coatings + composite material substrates. The process etches the metal coating on the surface without damaging, blackening, or carbonizing the composite material.
Friction Ring Etching
Etching depth 5±1μm, processing accuracy ±0.01mm, depth accuracy ±0.005mm. The part’s appearance has no scratches, oxidation, burrs, or remelting layer.
Hemispherical Metal Shield Cutting
Metal thickness: 0.3mm, tolerance: 0.1mm. Part size: φ300mm, height: 180mm, individual element size: 1.18mm. Processing accuracy: ±0.01mm, minimum processing size: 0.1mm. No burrs or oxidation after cutting.
Special Coating Microstructure Engraving Lines
Utilizes five-axis linkage (X, Y, Z, Gx, Gy) laser processing. Engraving line width ≤0.02mm, processing depth ≤0.01mm, and line spacing is 0.2±0.005mm. The engraved lines are uniform, with no significant bending or deformation, and appear blackened.