Presentation of the equipment's characteristics

The equipment uses high-power ultrafast laser as the processing light source. Based on the three-axis fixed gantry main machine, it is equipped with an optical double-swing axis core component. It is mainly used for precision etching of precise functional microstructures on the surfaces of large and complex three-dimensional curved parts. The equipment has five-axis five-linkage, curved model block splicing, parallel light projection and other functions, and can realize three-dimensional model processing and three-dimensional curved surface etching processing.

processed samples
  • It has the function of etching large and complex curved surfaces that cannot be expanded in three dimensions;
  • It has the function of three-dimensional model analysis and programming, which can realize accurate block division and path optimization of large-scale curved surface graphics;
  • It has the function of displaying the processing status of three-dimensional models, and visually displays the processing process;
  • It has mature visual alignment measurement and high-precision automatic ranging and focusing functions;
  • It has anti-collision function to ensure the safety of the processing process;
  • It has the function of hardware abnormal status monitoring, realizes human-computer interaction function, and is simple and easy to operate;
  • One-click generation of processing data avoids manual programming, simple and easy to operate, and the entire processing process is fully automated;
  • It has a safety interlocking function to prevent the safety door from opening during laser processing and harming personal safety;
  • It has air blowing and smoke purification functions.
ParameterValue
X/Y/Z Travel Range (mm)2000/1600/800
X/Y/Z Positioning Accuracy (mm)0.02
X/Y/Z Repeat Positioning Accuracy (mm)0.01
A/C Travel (°)±110/0-360
A/C Positioning Accuracy (″)15
A/C Repeat Positioning Accuracy (″)10
Pulse Width (ps)1-5
Average Power (w)50
Maximum Workpiece Size (Cylinder) (mm)Φ900×800
Single Frame Engraving/Welding Accuracy (mm)±0.02
Machine Weight (t)~25
Equipment Footprint (mm) (W×D×H)4100×6200×4500
Worktable Size (L×W) (mm)2000×1400
Worktable Load (kg)3000

Laser Etching Processing Solution Overview: Aiming at the complex curved surface high-precision metal and non-metal microstructure processing needs of aerospace, we focus on the laser high-quality and high-efficiency processing technology of complex curved surface microstructures, and provide customers with high-end precision processing services and a full set of product solutions including nanosecond laser, picosecond laser and femtosecond laser.

Results picturesdescription
Metal Material Surface Laser Texturing
Laser processing on high-temperature alloy surfaces, with a maximum roughness of Ra15. Thin-walled parts experience no deformation, oxidation, or remelting layer.
Composite Material Surface Laser Texturing
Laser processing on fiber-type composite material surfaces. It exposes the glass fiber layer without damaging the glass substrate, and the substrate does not blacken or carbonize.
Resonant Microstructure Etching (1)
Suitable for multi-layer metal coatings + composite substrates. The etching depth is ≤30μm, processing accuracy is ±0.01mm, and the minimum processing size is 0.1mm. The coating does not peel off after etching, and the substrate does not blacken or carbonize.
Resonant Microstructure Etching (2)
Suitable for 70μm copper coatings + glass fiber composites. The etching depth is ≤30μm, processing accuracy is ±0.01mm, and the minimum processing size is 0.1mm. The copper coating has no residue, and substrate damage is minimal.
Resonant Microstructure Etching (3)
Suitable for 3μm aluminum coatings + glass fiber composites. The etching depth is ≤5μm, processing accuracy is ±0.01mm, and the minimum processing size is 0.1mm. No aluminum particles residues, and the glass fiber does not carbonize.
Resonant Microstructure Etching（4）
Processing accuracy ±0.01mm, minimum processing size 0.1mm. Suitable for metal coatings + composite material substrates. The process etches the metal coating on the surface without damaging, blackening, or carbonizing the composite material.
Friction Ring Etching
Etching depth 5±1μm, processing accuracy ±0.01mm, depth accuracy ±0.005mm. The part’s appearance has no scratches, oxidation, burrs, or remelting layer.
Hemispherical Metal Shield Cutting
Metal thickness: 0.3mm, tolerance: 0.1mm. Part size: φ300mm, height: 180mm, individual element size: 1.18mm. Processing accuracy: ±0.01mm, minimum processing size: 0.1mm. No burrs or oxidation after cutting.
Special Coating Microstructure Engraving Lines
Utilizes five-axis linkage (X, Y, Z, Gx, Gy) laser processing. Engraving line width ≤0.02mm, processing depth ≤0.01mm, and line spacing is 0.2±0.005mm. The engraved lines are uniform, with no significant bending or deformation, and appear blackened.