GST-Y150Plus Selective Electron Beam Melting(EBM/SEBM) Equipment (High-precision, small-batch production versions of complex parts)

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Presentation of the equipment's characteristics

Finer electron beam spot and higher forming accuracy
Designed for high-precision, small-batch production of complex parts such as orthopedic implants
Maximum forming size: 170×170×180 mm; Applicable materials: titanium and titanium alloys, tantalum, zirconium-niobium alloys, etc.

processed samples
  • More refined electron beam spot (≤100μm), specifically designed for precision manufacturing of complex parts such as orthopedic implants.
  • Low powder loading per batch, cathode lifespan >500h, reducing equipment usage and maintenance costs.
  • Powder bed preheating temperature above 1300℃, reducing forming stress and allowing the production of brittle, crack-prone materials.
  • Electron gun cathode and auxiliary cathode are both made of tungsten, offering high durability and enabling cost-effective part manufacturing.
  • Utilizes downward powder feeding technology with real-time monitoring of powder flow, improving powder spreading accuracy and stability while reducing powder flowability requirements during printing.
  • High electron beam penetration, deeper molten pool, high energy absorption efficiency, faster forming speed, and denser formed parts.
  • Proprietary SEBM process system, capable of self-adjusting process parameters to accommodate different metal materials.
  • Vacuum environment printing results in minimal oxygen increment, purer parts, greater design freedom, less support, and no need for post-heat treatment.
Max. build size170×170×180 mm
Beam power6 kW
Electron accelerating voltage60 kV
Beam current0～50 mA
Filament life＞500 h
Cathode typeIndirectly heated tungsten cathode
Min. beam diameter≤100 μm
Max. powder bed preheat temperature1300 ℃
Ultimate vacuum5×10-3 Pa
Build accuracy of components ±0.1 mm
External dimension2000×1200×2150 mm3
Machine weight1.5 t
CAD (interface)STL
Control softwareSEBM-ICS